The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2020
Filed:
Dec. 07, 2015
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Jong Suk Jeong, Suwon-si, KR;
Kang Heon Hur, Suwon-si, KR;
Seong Jae Lee, Suwon-si, KR;
Jung Wook Seo, Suwon-si, KR;
Hiroyuki Matsumoto, Suwon-si, KR;
Chul Min Sim, Suwon-si, KR;
Jong Sik Yoon, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonngi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/36 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01F 27/365 (2013.01); H01F 17/0013 (2013.01); H01F 2017/0066 (2013.01);
Abstract
A chip electronic component includes a magnetic body including magnetic metal powder particles, an internal coil unit embedded in the magnetic body, and a cover unit disposed on at least one of upper and lower surfaces of the magnetic body and including a magnetic metal plate. The magnetic metal plate is cracked and includes a plurality of metal fragments.