The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Aug. 23, 2019
Applicant:

Phoenix & Corporation, Grand Cayman, KY;

Inventors:

Wen-Hung Hu, Hsinchu County, TW;

Tsung-Yueh Chen, Hsinchu County, TW;

Assignee:

PHOENIX & CORPORATION, Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01F 7/06 (2006.01); H01F 41/04 (2006.01); H05K 1/16 (2006.01); H01L 23/498 (2006.01); H05K 3/30 (2006.01); H05K 3/00 (2006.01); H01L 21/48 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01F 7/06 (2013.01); H01F 41/041 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H05K 1/165 (2013.01); H05K 1/187 (2013.01); H05K 3/0044 (2013.01); H05K 3/30 (2013.01); H05K 3/4644 (2013.01); H01F 2007/068 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/166 (2013.01);
Abstract

An integrated driving module with energy conversion function includes a patterned conductive circuit layer, an integrated electromagnetic induction component layer, a second dielectric layer, an embedded electrical component and a conductive component. The integrated electromagnetic induction component layer, which has a plurality of conductive coil layer, a plurality of conductive connecting component and a first dielectric layer, is disposed on the patterned conductive circuit layer. The conductive coil layers are stacked. Each conductive connecting component is electrically connected between the two conductive coil layers and between the corresponding conductive coil layer and the patterned conductive circuit layer. The first dielectric layer covers the conductive coil layers and the conductive connecting components. The second dielectric layer covers the patterned conductive circuit layer. The embedded component and the conductive component are disposed in the second dielectric layer electrically connected the patterned conductive circuit layer.


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