The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Sep. 13, 2017
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Takuma Shimoichi, Kyoto, JP;

Yasuhiro Kondo, Kyoto, JP;

Keishi Watanabe, Kyoto, JP;

Takamichi Torii, Kyoto, JP;

Katsuya Matsuura, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01C 1/01 (2006.01); H01F 27/29 (2006.01); H01G 4/30 (2006.01); H01G 4/228 (2006.01); H01F 17/00 (2006.01); H01C 1/02 (2006.01); H05K 1/02 (2006.01); H01C 17/26 (2006.01); H05K 1/16 (2006.01); H01C 1/142 (2006.01); H01C 7/00 (2006.01); H01L 23/522 (2006.01); H01C 13/02 (2006.01); H01L 49/02 (2006.01); H01G 4/33 (2006.01); H01C 1/14 (2006.01);
U.S. Cl.
CPC ...
H01C 1/01 (2013.01); H01C 1/02 (2013.01); H01C 1/14 (2013.01); H01C 1/142 (2013.01); H01C 7/006 (2013.01); H01C 13/02 (2013.01); H01C 17/267 (2013.01); H01F 17/0006 (2013.01); H01F 27/2804 (2013.01); H01F 27/292 (2013.01); H01G 4/228 (2013.01); H01G 4/30 (2013.01); H01G 4/33 (2013.01); H01L 23/5228 (2013.01); H01L 28/20 (2013.01); H05K 1/0293 (2013.01); H05K 1/167 (2013.01); H01F 2017/0026 (2013.01); H05K 1/162 (2013.01); H05K 1/165 (2013.01);
Abstract

A chip part is provided that includes a substrate in which an element region and an electrode region are set, an insulating film (a first insulating film and a second insulating film) which is formed on the substrate and which selectively includes an internal concave/convex structure in the electrode region on a surface, a first connection electrode and a second connection electrode which include, at a bottom portion, an anchor portion entering the concave portion of the internal concave/convex structure and which include an external concave/convex structure on a surface on the opposite side and a circuit element which is disposed in the element region and which is electrically connected to the first connection electrode and the second connection electrode.


Find Patent Forward Citations

Loading…