The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2020
Filed:
May. 26, 2015
Applicant:
Toyo Aluminium Kabushiki Kaisha, Osaka-shi, Osaka, JP;
Inventors:
Sotaro Akiyama, Osaka, JP;
Yoshitaka Nishio, Osaka, JP;
Assignee:
TOYO ALUMINIUM KABUSHIKI KAISHA, Osaka-Shi, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); C22C 21/00 (2006.01); C22F 1/04 (2006.01); B23K 35/02 (2006.01); B23K 35/28 (2006.01); B21B 3/00 (2006.01); B21B 1/04 (2006.01); B21B 1/40 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H01B 1/023 (2013.01); B21B 1/04 (2013.01); B21B 1/40 (2013.01); B21B 3/00 (2013.01); B23K 35/0233 (2013.01); B23K 35/286 (2013.01); B23K 35/288 (2013.01); C22C 21/003 (2013.01); C22F 1/04 (2013.01); B21B 2003/001 (2013.01); H05K 1/09 (2013.01); H05K 2201/0355 (2013.01);
Abstract
An aluminum foil having a high adhesiveness to solder and containing at least one of Sn and Bi, in which a ratio of a total mass of Sn and Bi to a total mass of the aluminum foil is 0.0075 mass % or more and 15 mass % or less.