The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Nov. 15, 2018
Applicant:

Hewlett Packard Enterprise Development Lp, Houston, TX (US);

Inventors:

John Franz, Houston, TX (US);

William K. Norton, Houston, TX (US);

Ernesto Ferrer Medina, Houston, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01); G11C 5/04 (2006.01); H01L 27/108 (2006.01); H01L 23/473 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
G06F 1/20 (2013.01); G11C 5/04 (2013.01); H01L 23/427 (2013.01); H01L 23/473 (2013.01); H01L 27/10844 (2013.01); H01L 27/10897 (2013.01); H05K 1/0209 (2013.01); H05K 7/20254 (2013.01); H05K 7/20509 (2013.01); H05K 7/20772 (2013.01); H05K 7/20809 (2013.01); G06F 2200/201 (2013.01);
Abstract

A system for cooling memory modules mounted in parallel on a printed circuit board may include a coolant tube installed in parallel between two of the memory modules, and a heat spreader disposed in parallel between the two memory modules. The heat spreader may include a base having an outer surface thermally coupled to the coolant tube and first and second fins. The first fin has a first spring force toward a first of the two memory modules. The first spring force causes the first fin to provide contact pressure to the first memory module to thermally couple the first fin and the first memory module. The second fin has a second spring force toward a second of the two memory modules. The second spring force causes the second fin to provide contact pressure to the second memory module to thermally couple the second fin and the second memory module.


Find Patent Forward Citations

Franz, John. (2020). Heat removal from memory modules (U.S. Patent No. 10705578). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10705578

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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