The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

May. 13, 2019
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Tatsuya Suzuki, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03G 15/00 (2006.01); H01R 12/52 (2011.01); H05K 1/14 (2006.01); G03G 15/20 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G03G 15/80 (2013.01); G03G 15/2053 (2013.01); H01R 12/52 (2013.01); H05K 1/14 (2013.01); H05K 1/181 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10303 (2013.01);
Abstract

A first connector is soldered to a first board. A second connector is soldered to a second board. A third connector and a fourth connector are soldered to a relay board. The third connector is connected to the first connector via a first power line. The fourth connector is connected to the second connector via a second power line. A surface to which the first connector is soldered on the first board is opposite to a surface to which the first connector is attached on the first board. A surface to which the second connector is soldered on the second board is a surface to which the second connector is attached on the second board. Only surface-mount devices are used as electronic components soldered to the second board.


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