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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10705425 B1

PDFFull Text
Date of Patent:
Jul. 07, 2020

Filed:

Feb. 29, 2016

Photosensitive resin composition, photosensitive, sheet, semiconductor device and method for manufacturing semiconductor device

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Hiroyuki Onishi, Otsu, JP;

Yuki Masuda, Otsu, JP;

Assignee:

TORAY INDUSTRIES, INC., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

John S Chu

Int. Cl.
CPC ...
G03F 7/038 (2006.01); G03F 7/40 (2006.01); C08G 65/333 (2006.01); C08G 65/331 (2006.01); G03F 7/023 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); G03F 7/022 (2006.01); H01L 21/304 (2006.01); C08L 63/00 (2006.01); C08G 59/14 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0382 (2013.01); C08G 59/14 (2013.01); C08G 65/331 (2013.01); C08G 65/333 (2013.01); C08L 63/00 (2013.01); G03F 7/022 (2013.01); G03F 7/023 (2013.01); G03F 7/038 (2013.01); G03F 7/40 (2013.01); H01L 21/0275 (2013.01); H01L 21/02118 (2013.01); H01L 21/02282 (2013.01); H01L 21/304 (2013.01); H01L 21/311 (2013.01);
Abstract

A photosensitive resin composition which contains a compound represented by general formula (1). (In general formula (1), R-Rmay be the same or different, and each represents a hydrogen atom or an organic group having 1-4 carbon atoms; and X represents a tetravalent organic group having two or more structural units represented by general formula (2) in the main chain.) (In general formula (2), Rrepresents a hydrogen atom or an alkyl group having 1-20 carbon atoms, and a plurality of Rs in the same molecule may be the same or different.) Provided is a photosensitive resin composition which enables the achievement of a cured film having low stress after being heated and fired, and which has excellent long-term stability, high sensitivity and high resolution.

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