The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2020
Filed:
Jan. 02, 2018
Applicant:
Industrial Technology Research Institute, Hsinchu, TW;
Inventors:
Pin-Hao Hu, Hsinchu, TW;
Shao-Chuan Lu, Hsinchu, TW;
Hsuan-Chang Lee, Hsinchu, TW;
Po-Huan Chou, Hsinchu, TW;
Min-Kai Lee, Hsinchu, TW;
Assignee:
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 26/08 (2006.01); G02B 27/40 (2006.01); G02B 27/14 (2006.01); B23K 26/035 (2014.01); B23K 26/06 (2014.01); B23K 26/067 (2006.01); G02B 27/28 (2006.01); B23K 26/402 (2014.01); B23K 26/384 (2014.01); B23K 26/40 (2014.01); B23K 26/382 (2014.01); B23K 26/082 (2014.01); G02B 26/10 (2006.01); B23K 103/00 (2006.01); B23K 101/00 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
G02B 26/0816 (2013.01); B23K 26/035 (2015.10); B23K 26/067 (2013.01); B23K 26/0643 (2013.01); B23K 26/0648 (2013.01); B23K 26/082 (2015.10); B23K 26/384 (2015.10); B23K 26/389 (2015.10); B23K 26/40 (2013.01); B23K 26/402 (2013.01); G02B 27/14 (2013.01); G02B 27/286 (2013.01); G02B 27/40 (2013.01); B23K 2101/001 (2018.08); B23K 2101/42 (2018.08); B23K 2103/00 (2018.08); B23K 2103/42 (2018.08); B23K 2103/52 (2018.08); B23K 2103/54 (2018.08); G02B 26/10 (2013.01);
Abstract
A light emitting method includes passing a laser beam through at least one offset assembly and a focusing assembly in sequence, and actuating, by a control-manipulating mechanism, the offset assembly to cause the laser beam to be offset, so that the laser beam can quickly produce a controllable opening of any shape in a drilling process.