The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2020
Filed:
Jan. 26, 2017
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Nicolas Degrenne, Rennes, FR;
Stefan Mollov, Rennes, FR;
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2020.01); G01R 31/28 (2006.01); G01R 31/00 (2006.01); G01K 1/14 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2642 (2013.01); G01K 1/14 (2013.01); G01R 31/007 (2013.01); G01R 31/2619 (2013.01); G01R 31/2848 (2013.01); G01R 31/2849 (2013.01);
Abstract
The present invention concerns a method and a device for estimating a level of damage or a lifetime expectation of a power semiconductor module comprising at least one die that is mechanically, thermally, and electrically attached to a substrate, composed of plural layers of different materials. The invention: