The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10705064 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 07, 2020

Filed:

Sep. 12, 2017
Applicant:

Point Engineering Co., Ltd., Asan, KR;

Inventors:

Bum Mo Ahn, Suwon, KR;

Seung Ho Park, Hwaseong, KR;

Tae Hwan Song, Cheonan, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 5/012 (2006.01); G01N 33/00 (2006.01); G01N 27/04 (2006.01);
U.S. Cl.
CPC ...
G01N 33/0027 (2013.01); G01N 27/04 (2013.01);
Abstract

Disclosed is a microsensor package. Particularly, disclosed is a microsensor package configured such that a substrate with a sensor electrode is formed with a plurality of pores penetrating vertically therethrough, the lower surface of the substrate is formed with a bonding portion, and the pores under the sensor electrode pad are provided therein with respective connecting portions electrically connecting the sensor electrode pad and the bonding portion, whereby it is possible to provide a light, slim, and compact microsensor package, and it is possible to mount the microsensor package to a printed circuit board (PCB) without wire bonding.


Find Patent Forward Citations

Ahn, Bum. (2020). Micro sensor package (U.S. Patent No. 10705064). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10705064

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