The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2020
Filed:
Aug. 08, 2017
Tyco Electronics (Shanghai) Co. Ltd., Shanghai, CN;
Tyco Electronics Technology (Sip) Co. Ltd., Suzhou, CN;
Tyco Electronics (Shanghai) Co. Ltd., Shanghai, CN;
Tyco Electronics (SIP) Co. Ltd., Suzhou, CN;
Abstract
The present disclosure discloses a temperature measuring apparatus, an electrical assembly, and a battery pack. The temperature measuring apparatus comprises a heat transfer element, a temperature measuring device, and a wiring board. The heat transfer element is arranged for being in heat conductive contact with an object to be measured. The temperature measuring device is provided in contact with the heat transfer element and arranged to be spaced from the object to be measured. The temperature measuring device is arranged for detecting a temperature of the object to be measured and may output a temperature signal. The wiring board is electrically connected with the temperature measuring device to receive and transmit the temperature signal outputted by the temperature measuring device. The present disclosure only requires a heat conductive contact between the heat transfer element and the temperature measuring device of the temperature measuring apparatus, thereby facilitating assembly. Compared with insulated isolation with the object to be measured by glue-filling after the single-core wire is connected with the temperature measuring device, the temperature measuring apparatus of the present disclosure greatly reduces the assembly procedures.