The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Dec. 26, 2017
Applicant:

Ushio Denki Kabushiki Kaisha, Tokyo, JP;

Inventors:

Masaki Inoue, Tokyo, JP;

Kiyoyuki Kabuki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21V 29/502 (2015.01); F21V 9/32 (2018.01); B23K 1/00 (2006.01); B32B 18/00 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
F21V 29/502 (2015.01); B23K 1/0008 (2013.01); B32B 18/00 (2013.01); F21V 9/32 (2018.02); B23K 2103/52 (2018.08); B32B 2307/422 (2013.01); B32B 2551/00 (2013.01);
Abstract

The present invention has as its object the provision of a fluorescent light source device capable of stably obtaining high luminous efficiency and a production process of the same. The fluorescent light source device of the present invention includes a fluorescent plate which has a fluorescent light-emitting layer formed of a polycrystalline material and in which a periodic structure body is formed on an excitation light incident side of the fluorescent light-emitting layer. The fluorescent plate has a thermal diffusion layer which is directly bonded to a front surface of the fluorescent light-emitting layer on the excitation light incident side and has a thermal conductivity larger than that of the fluorescent light-emitting layer, and a high thermal conductive layer provided on a back surface of the fluorescent light-emitting layer opposite to the excitation light incident side. The high thermal conductive layer is formed of a light reflection layer and a bonding layer made of a metal, and the fluorescent plate is provided so as to cover a part of a surface of a heat dissipation substrate disposed on a side of the high thermal conductive layer side.


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