IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10704741 B1

PDFFull Text
Date of Patent:
Jul. 07, 2020

Filed:

Oct. 24, 2019

Led filament and light bulb

Applicant:

Jiaxing Super Lighting Electric Appliance Co., Ltd, Jiaxing, CN;

Inventors:

Tao Jiang, Jiaxing, CN;

Liqin Li, Jiaxing, CN;

Assignee:

JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD, Zhejiang, CN;

Attorneys:

Andrew M. Calderon

Roberts Calderon Safran & Cole, P.C.

Primary Examiner:

Sean P Gramling

Int. Cl.
CPC ...
F21K 9/232 (2016.01); H01L 33/62 (2010.01); F21V 3/02 (2006.01); F21K 9/238 (2016.01); H01L 25/075 (2006.01); F21Y 115/10 (2016.01); F21V 3/06 (2018.01); F21Y 107/50 (2016.01); F21Y 107/00 (2016.01); F21Y 103/33 (2016.01); F21K 9/90 (2016.01); F21Y 103/37 (2016.01); F21V 19/00 (2006.01);
U.S. Cl.
CPC ...
F21K 9/232 (2016.08); F21K 9/238 (2016.08); F21V 3/02 (2013.01); H01L 33/62 (2013.01); F21K 9/90 (2013.01); F21V 3/061 (2018.02); F21V 3/062 (2018.02); F21V 19/003 (2013.01); F21Y 2103/33 (2016.08); F21Y 2103/37 (2016.08); F21Y 2107/00 (2016.08); F21Y 2107/50 (2016.08); F21Y 2115/10 (2016.08); H01L 25/0753 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/19107 (2013.01);
Abstract

An LED light bulb comprises an LED filament configured for emitting omnidirectional light. The filament comprises a linear array of LED chips operably interconnected to emit light upon energization, a conductive electrode electrically connected with the linear array of LED chips, and a light conversion coating enclosing the linear array of the LED chip and the electrode. The light conversion coating includes a top layer and a base layer conformally interconnected to form a unitary enclosure. The top layer is coated on a first side of the linear array of LED chips and the electrode. The base layer is coated on a second side of the linear array of LED chips and the electrode. A first LED chip in the linear array of LED chips is guided by the unitary enclosure to a different angle in relation to a second LED chip in the linear array of the LED chips.

Find Patent Forward Citations

Loading…