The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

May. 31, 2017
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Benjamin Paul Lacy, Greer, SC (US);

Brian Peter Arness, Simpsonville, SC (US);

Victor John Morgan, Simpsonville, SC (US);

Stephen William Tesh, Simpsonville, SC (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F01D 5/18 (2006.01); F01D 5/28 (2006.01); F02B 29/04 (2006.01);
U.S. Cl.
CPC ...
F01D 5/189 (2013.01); F01D 5/186 (2013.01); F01D 5/187 (2013.01); F01D 5/288 (2013.01); F02B 29/0456 (2013.01); F05D 2260/204 (2013.01); F05D 2260/84 (2013.01); F05D 2300/611 (2013.01);
Abstract

A hot gas path component of an industrial machine includes a cooling pathway. The component includes a body including an outer surface; a thermal barrier coating (TBC) over the outer surface, the TBC exposed to a working fluid having a high temperature; and an internal cooling circuit in the body carrying a cooling medium. A cooling pathway is in the body and in fluid communication with the internal cooling circuit. The cooling pathway includes a terminating end in the body and a length extending along and spaced internally from the outer surface by a first spacing. In response to a spall in the TBC occurring at a location over the cooling pathway and the high temperature reaching or exceeding a predetermined temperature of the body, the cooling pathway opens at the location through the first spacing to allow a flow of the cooling medium therethrough.


Find Patent Forward Citations

Loading…