The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Dec. 17, 2015
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Shinichi Oki, Chiba-Ken, JP;

Yuji Aoki, Yokohama, JP;

Peter Demonte, Millbrae, CA (US);

Yoshinobu Mori, Ohmura, JP;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/455 (2006.01); C23C 16/458 (2006.01); H01L 21/687 (2006.01); C23C 16/46 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
C23C 16/458 (2013.01); C23C 16/4586 (2013.01); C23C 16/46 (2013.01); H01L 21/67109 (2013.01); H01L 21/68742 (2013.01); C23C 16/455 (2013.01);
Abstract

A processing chamber for processing a substrate is disclosed herein. In one embodiment, the processing chamber includes a support shaft assembly. The support shaft assembly has a ring shaped susceptor, a disc shaped heat plate, and a support shaft system. The support shaft system supports the susceptor and the heat plate, such that the susceptor is supported above the heat plate defining a gap between the heat plate and the susceptor. In another embodiment, the heat plate includes a plurality of grooves and the susceptor includes a plurality of fins. The fins are configured to sit within the grooves such that the susceptor is supported above the heat plate, defining a gap between the heat plate and the susceptor. In another embodiment, a method of processing a substrate in the aforementioned embodiments is disclosed herein.


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