The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Oct. 10, 2017
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Andrew Joseph Detor, Burnt Hills, NY (US);

Richard DiDomizio, Charlton, NY (US);

James Anthony Ruud, Delmar, NY (US);

Soumya Nag, Clifton Park, NY (US);

Assignee:

GENERAL ELECTRIC COMPANY, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 4/08 (2016.01); C23C 4/129 (2016.01); C09D 1/00 (2006.01); C23C 28/02 (2006.01); C09D 7/61 (2018.01); C23C 4/06 (2016.01); B32B 15/01 (2006.01); C09D 5/00 (2006.01); B23K 35/30 (2006.01); C22C 19/05 (2006.01); C23C 4/02 (2006.01); C23C 24/04 (2006.01); C23C 30/00 (2006.01);
U.S. Cl.
CPC ...
C23C 4/08 (2013.01); B23K 35/308 (2013.01); B32B 15/01 (2013.01); B32B 15/013 (2013.01); B32B 15/015 (2013.01); C09D 1/00 (2013.01); C09D 5/00 (2013.01); C09D 7/61 (2018.01); C22C 19/05 (2013.01); C23C 4/02 (2013.01); C23C 4/06 (2013.01); C23C 4/129 (2016.01); C23C 24/04 (2013.01); C23C 28/021 (2013.01); C23C 28/023 (2013.01); C23C 28/027 (2013.01); C23C 30/00 (2013.01);
Abstract

A system and method described herein relate to applying an overlay metal-based coating to a metal-based substrate. An article is provided, which includes a metal-based substrate having an overlay metal-based coating disposed on the substrate at an interface. The interface is configured such that a crack formed within the overlay metal-based coating and approaching the interface has a propagation path that is more energetically favorable along the interface than through the interface and into the metal-based substrate.


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