The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Feb. 25, 2016
Applicant:

Nippon Steel & Sumitomo Metal Corporation, Tokyo, JP;

Inventors:

Takeshi Yasui, Tokyo, JP;

Hiroyuki Kawata, Tokyo, JP;

Yuji Yamaguchi, Tokyo, JP;

Ryosuke Komami, Tokyo, JP;

Satoshi Uchida, Tokyo, JP;

Akinobu Murasato, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 2/06 (2006.01); C23C 2/02 (2006.01); C23C 2/28 (2006.01); C23C 2/40 (2006.01); C21D 9/46 (2006.01); C21D 8/02 (2006.01); C21D 6/00 (2006.01); C22C 38/28 (2006.01); C22C 38/22 (2006.01); C22C 38/16 (2006.01); C22C 38/08 (2006.01); C22C 38/14 (2006.01); C22C 38/12 (2006.01); C22C 38/06 (2006.01); C22C 38/04 (2006.01); C22C 38/02 (2006.01); C22C 38/00 (2006.01); C22C 38/38 (2006.01); C23C 2/26 (2006.01); C23C 2/00 (2006.01); C23C 28/02 (2006.01); C23C 30/00 (2006.01); C23C 2/04 (2006.01); B32B 15/04 (2006.01); B32B 15/01 (2006.01); B32B 15/18 (2006.01); C22C 38/18 (2006.01); C22C 38/40 (2006.01); C22C 38/48 (2006.01); C22C 18/00 (2006.01); C22C 38/20 (2006.01); C22C 38/44 (2006.01); C22C 38/50 (2006.01); C22C 38/42 (2006.01); C22C 38/54 (2006.01); C22C 38/26 (2006.01); C22C 38/58 (2006.01); C22C 38/32 (2006.01); C22C 38/34 (2006.01); C23G 1/00 (2006.01);
U.S. Cl.
CPC ...
C23C 2/06 (2013.01); B32B 15/01 (2013.01); B32B 15/013 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/18 (2013.01); C21D 6/001 (2013.01); C21D 6/002 (2013.01); C21D 6/005 (2013.01); C21D 6/008 (2013.01); C21D 8/0205 (2013.01); C21D 8/0226 (2013.01); C21D 8/0236 (2013.01); C21D 8/0263 (2013.01); C21D 8/0278 (2013.01); C21D 9/46 (2013.01); C22C 18/00 (2013.01); C22C 38/001 (2013.01); C22C 38/002 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C22C 38/08 (2013.01); C22C 38/12 (2013.01); C22C 38/14 (2013.01); C22C 38/16 (2013.01); C22C 38/18 (2013.01); C22C 38/20 (2013.01); C22C 38/22 (2013.01); C22C 38/26 (2013.01); C22C 38/28 (2013.01); C22C 38/32 (2013.01); C22C 38/34 (2013.01); C22C 38/38 (2013.01); C22C 38/40 (2013.01); C22C 38/42 (2013.01); C22C 38/44 (2013.01); C22C 38/48 (2013.01); C22C 38/50 (2013.01); C22C 38/54 (2013.01); C22C 38/58 (2013.01); C23C 2/00 (2013.01); C23C 2/02 (2013.01); C23C 2/04 (2013.01); C23C 2/26 (2013.01); C23C 2/28 (2013.01); C23C 2/40 (2013.01); C23C 28/023 (2013.01); C23C 28/025 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); C23G 1/00 (2013.01); Y10T 428/12792 (2015.01); Y10T 428/12799 (2015.01); Y10T 428/12951 (2015.01); Y10T 428/12958 (2015.01); Y10T 428/12972 (2015.01); Y10T 428/12979 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24942 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/24975 (2015.01); Y10T 428/24983 (2015.01); Y10T 428/26 (2015.01); Y10T 428/263 (2015.01); Y10T 428/264 (2015.01); Y10T 428/265 (2015.01); Y10T 428/2949 (2015.01);
Abstract

A high-strength hot-dip galvanized steel sheet excellent in impact resistance and worked portion corrosion resistance including a hot-dip galvanized plating layer on a steel sheet base material whose tensile strength is 590 MPa or more, wherein the plating layer includes projecting alloy layers being in contact with the steel sheet base material, a number density of the projecting alloy layers is 4 pieces/mm or more, wherein the steel sheet base material includes: a miniaturized layer being directly in contact with the interface between the steel sheet base material and the plating layer; a decarburized layer being in contact with the miniaturized layer; and an inner layer other than the miniaturized layer and the decarburized layer, and one or more kinds of oxides of Si and Mn are contained in layers of the miniaturized layer, the decarburized layer, and the projecting alloy layers.


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