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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10704008 B1

PDFFull Text
Date of Patent:
Jul. 07, 2020

Filed:

Apr. 06, 2016

Heat-conductive silicone grease composition

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventor:

Nobuhiro Ichiroku, Annaka, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Ling Siu Choi

Assistant Examiner:

Ronald Grinsted

Int. Cl.
CPC ...
C10M 169/04 (2006.01); C08K 3/08 (2006.01); C08K 3/28 (2006.01); C08L 63/00 (2006.01); C08L 83/04 (2006.01); C09K 5/14 (2006.01); C10M 107/24 (2006.01); C10M 125/04 (2006.01); C10M 125/10 (2006.01); C10M 125/20 (2006.01); C10M 125/26 (2006.01); C10M 169/02 (2006.01); C10M 107/50 (2006.01);
U.S. Cl.
CPC ...
C10M 169/04 (2013.01); C08K 3/08 (2013.01); C08K 3/28 (2013.01); C08L 63/00 (2013.01); C08L 83/04 (2013.01); C09K 5/14 (2013.01); C10M 107/24 (2013.01); C10M 107/50 (2013.01); C10M 125/04 (2013.01); C10M 125/10 (2013.01); C10M 125/20 (2013.01); C10M 125/26 (2013.01); C10M 169/02 (2013.01); C10M 2201/05 (2013.01); C10M 2201/061 (2013.01); C10M 2201/062 (2013.01); C10M 2201/105 (2013.01); C10M 2209/1016 (2013.01); C10M 2229/025 (2013.01); C10M 2229/0415 (2013.01); C10M 2229/0435 (2013.01); C10M 2229/0465 (2013.01); C10M 2229/0485 (2013.01); C10N 2210/02 (2013.01); C10N 2210/03 (2013.01); C10N 2210/04 (2013.01); C10N 2210/08 (2013.01); C10N 2220/022 (2013.01); C10N 2220/082 (2013.01); C10N 2230/02 (2013.01); C10N 2230/08 (2013.01); C10N 2250/10 (2013.01);
Abstract

A heat-conductive silicone grease composition comprising (A) an organopolysiloxane in an amount of 20 to 90 parts by mass, (B) a non-silicone-type organic compound in an amount of 80 to 10 parts by mass (wherein the total amount of the components (A) and (B) is 100 parts by mass) and (C) a heat-conductive inorganic filler having an average particle diameter of 0.5 to 100 μm in an amount of 200 to 2,000 parts by mass relative to 100 parts by mass of the total amount of the components (A) and (B), wherein the SP value of the non-silicone-type organic compound (B) is greater than that of the organopolysiloxane (A) (i.e., (B)>(A)), the value obtained by subtracting the SP value of the component (A) from the SP value of the component (B) is greater than 2, and the viscosity of the heat-conductive silicone grease composition is 50 to 1,000 Pa·s at 25° C.

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