The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

May. 03, 2018
Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Tomohiro Iwano, Hitachi, JP;

Hirotaka Akimoto, Hitachi, JP;

Takenori Narita, Hitachi, JP;

Tadahiro Kimura, Hitachi, JP;

Daisuke Ryuzaki, Kokubunji, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K 3/14 (2006.01); B24B 37/04 (2012.01); H01L 21/3105 (2006.01); C09G 1/02 (2006.01);
U.S. Cl.
CPC ...
C09K 3/1463 (2013.01); B24B 37/044 (2013.01); C09G 1/02 (2013.01); H01L 21/31053 (2013.01);
Abstract

The slurry of the invention comprises abrasive grains and water, wherein the abrasive grains include tetravalent cerium hydroxide particles and produce light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with the content of the abrasive grains adjusted to 1.0 mass %. The polishing liquid of the invention comprises abrasive grains, an additive and water, wherein the abrasive grains include tetravalent cerium hydroxide particles and produce light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with the content of the abrasive grains adjusted to 1.0 mass %.


Find Patent Forward Citations

Loading…