The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Sep. 08, 2017
Applicant:

Elite Electronic Material (Zhongshan) Co., Ltd., Zhongshan, Guang Dong Prov., CN;

Inventors:

Zhilong Hu, Zhongshan, CN;

Licheng Lin, Zhongshan, CN;

Assignee:

ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD., Zhongshan, Guang Dong Province, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 79/04 (2006.01); B32B 5/02 (2006.01); B32B 15/14 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); C08J 5/18 (2006.01); C08J 5/24 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
C08L 79/04 (2013.01); B32B 5/02 (2013.01); B32B 15/08 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08J 5/18 (2013.01); C08J 5/24 (2013.01); H05K 1/0353 (2013.01); H05K 1/09 (2013.01); B32B 2260/046 (2013.01); B32B 2307/3065 (2013.01); B32B 2457/08 (2013.01); C08J 2379/04 (2013.01); C08J 2463/00 (2013.01); C08J 2463/04 (2013.01); C08J 2479/04 (2013.01); C08L 2203/16 (2013.01); C08L 2203/20 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01); H05K 1/0373 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0209 (2013.01);
Abstract

Disclosed is a resin composition, which comprises 30 parts by weight to 90 parts by weight of a maleimide resin and 15 parts by weight to 60 parts by weight of a benzoxazine resin. The resin composition may be fabricated into various articles, such as prepregs, prepregs with copper foil, resin films, resin films with copper foil, laminates or printed circuit boards, which possess at least one, more or all of the following properties: high peel strength, high thermal resistance after moisture absorption, high glass transition temperature, low thermal expansion, high thermal resistance, low dielectric constant, low dissipation factor and so on.


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