The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2020
Filed:
Aug. 09, 2018
Applicant:
Furukawa Electric Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08L 27/06 (2006.01); C08L 11/00 (2006.01); C08L 15/02 (2006.01); C08K 5/14 (2006.01); C08K 3/22 (2006.01); C08K 3/26 (2006.01); C08K 3/36 (2006.01); C08J 3/00 (2006.01); C08L 27/08 (2006.01); H01B 3/00 (2006.01); C08L 101/04 (2006.01); C08K 5/5419 (2006.01); H01B 3/44 (2006.01); C08L 101/00 (2006.01); C09D 127/06 (2006.01); C08J 3/24 (2006.01); C08K 3/013 (2018.01); H01B 7/29 (2006.01); H01B 7/28 (2006.01);
U.S. Cl.
CPC ...
C08L 27/06 (2013.01); C08J 3/005 (2013.01); C08J 3/247 (2013.01); C08K 3/013 (2018.01); C08K 3/2279 (2013.01); C08K 3/26 (2013.01); C08K 3/36 (2013.01); C08K 5/14 (2013.01); C08K 5/5419 (2013.01); C08L 11/00 (2013.01); C08L 15/02 (2013.01); C08L 27/08 (2013.01); C08L 101/00 (2013.01); C08L 101/04 (2013.01); C09D 127/06 (2013.01); H01B 3/006 (2013.01); H01B 3/443 (2013.01); C08J 2311/00 (2013.01); C08J 2323/28 (2013.01); C08K 2003/2224 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/265 (2013.01); C08L 2203/202 (2013.01); C08L 2310/00 (2013.01); C08L 2312/08 (2013.01); H01B 7/28 (2013.01); H01B 7/29 (2013.01);
Abstract
A method that has a step (a) of melt-kneading 0.003 to 0.3 part by mass of an organic peroxide, 0.5 to 400 parts by mass of an inorganic filler, and more than 2 parts by mass and 15.0 parts by mass or less of a silane coupling agent, with respect to 100 parts by mass of a resin containing a halogen-containing resin, at a temperature equal to or higher than a decomposition temperature of the organic peroxide, to prepare a silane master batch; a heat-resistant crosslinked resin formed body obtained by the method, a silane master batch, a mixture and a formed body thereof, and a heat-resistant product.