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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10703892 B1

PDFFull Text
Date of Patent:
Jul. 07, 2020

Filed:

Apr. 24, 2017

Resin composition and molded body

Applicant:

Asahi Kasei Kabushiki Kaisha, Tokyo, JP;

Inventors:

Yasuhiro Kusanose, Tokyo, JP;

Hiroyuki Ichino, Tokyo, JP;

Masashi Yamamoto, Tokyo, JP;

Assignee:

Asahi Kasei Kabushiki Kaisha, Tokyo, JP;

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

Jeffrey C Mullis

Int. Cl.
CPC ...
C08L 23/12 (2006.01); C08L 53/02 (2006.01); C08L 23/10 (2006.01); C08F 8/04 (2006.01); C08L 23/14 (2006.01); C08F 210/08 (2006.01); C08F 212/08 (2006.01); C08L 53/00 (2006.01);
U.S. Cl.
CPC ...
C08L 23/142 (2013.01); C08F 8/04 (2013.01); C08F 210/08 (2013.01); C08F 212/08 (2013.01); C08L 23/10 (2013.01); C08L 23/12 (2013.01); C08L 23/14 (2013.01); C08L 53/005 (2013.01); C08L 53/02 (2013.01); C08L 53/025 (2013.01); C08F 2500/03 (2013.01); C08F 2500/17 (2013.01); C08F 2800/20 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01); C08L 2207/10 (2013.01);
Abstract

The resin composition according to the present invention contains a polypropylene resin (a), a hydrogenated block copolymer (b), and a hydrogenated block copolymer (c), wherein: a mass ratio of a content of the hydrogenated block copolymer (b) to a content of the hydrogenated block copolymer (c), (b)/(c), is 90/10 to 10/90; a mass ratio of a content of the polypropylene resin (a) to a total content of the hydrogenated block copolymer (b) and the hydrogenated block copolymer (c), (a)/((b)+(c)), is 10/90 to 90/10; and specific polymer blocks (C), (B1), and (B2) differing in amount of vinyl bond before hydrogenation are contained at a specific ratio.

Find Patent Forward Citations

Kusanose, Yasuhiro. (2020). Resin composition and molded body (U.S. Patent No. 10703892). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10703892

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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