The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2020
Filed:
Jul. 04, 2016
Applicant:
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Inventors:
Yoichi Takano, Tokyo, JP;
Nobuyoshi Ohnishi, Tokyo, JP;
Katsuya Tomizawa, Tokyo, JP;
Naoki Kashima, Tokyo, JP;
Hiroshi Takahashi, Tokyo, JP;
Eisuke Shiga, Tokyo, JP;
Assignee:
MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/00 (2006.01); C08J 5/24 (2006.01); C08F 222/40 (2006.01); B32B 17/04 (2006.01); C09D 4/00 (2006.01); C09D 4/06 (2006.01); C08F 236/20 (2006.01); B32B 5/28 (2006.01); B32B 27/00 (2006.01); C08F 2/44 (2006.01); H05K 1/03 (2006.01); B32B 5/02 (2006.01); B32B 15/14 (2006.01); C08G 73/10 (2006.01); H01L 23/14 (2006.01); H01L 23/00 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 3/36 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
C08J 5/24 (2013.01); B32B 5/02 (2013.01); B32B 5/28 (2013.01); B32B 15/14 (2013.01); B32B 17/04 (2013.01); B32B 27/00 (2013.01); C08F 2/44 (2013.01); C08F 222/40 (2013.01); C08F 236/20 (2013.01); C08G 73/00 (2013.01); C08G 73/106 (2013.01); C09D 4/00 (2013.01); C09D 4/06 (2013.01); H01L 23/145 (2013.01); H01L 23/562 (2013.01); H05K 1/03 (2013.01); B32B 2250/02 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2311/12 (2013.01); B32B 2457/08 (2013.01); C08J 2333/24 (2013.01); C08K 3/36 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/282 (2013.01); H01L 21/4846 (2013.01);
Abstract
The resin composition of the present invention comprises an alkenyl-substituted nadimide (A), a maleimide compound (B), and an amino-modified silicone (C).