The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

May. 19, 2015
Applicant:

Daicel Corporation, Osaka-shi, Osaka, JP;

Inventor:

Takanori Kobatake, Ohtake, JP;

Assignee:

DAICEL CORPORATION, Osaka-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08G 59/62 (2006.01); C08G 59/72 (2006.01); C08K 3/36 (2006.01); C08K 5/524 (2006.01); C08L 67/04 (2006.01); C08K 5/00 (2006.01); C08G 59/24 (2006.01); C08K 5/527 (2006.01); C08J 9/32 (2006.01); C08K 7/28 (2006.01);
U.S. Cl.
CPC ...
C08G 59/62 (2013.01); C08G 59/24 (2013.01); C08G 59/72 (2013.01); C08K 3/36 (2013.01); C08K 5/005 (2013.01); C08K 5/524 (2013.01); C08K 5/527 (2013.01); C08L 63/00 (2013.01); C08L 67/04 (2013.01); C08J 9/32 (2013.01); C08J 2201/026 (2013.01); C08J 2203/22 (2013.01); C08J 2363/00 (2013.01); C08K 7/28 (2013.01);
Abstract

The present invention relates to an epoxy resin composition containing an alicyclic epoxy compound (A), a polymer polyol having two or more terminal hydroxyl groups (B), and a Lewis acid-amine complex (C). The present invention provides an epoxy resin composition which can be cured by heating at low temperatures, and suppresses heat generation associated with curing (heat generation by curing). It is preferable that the epoxy resin composition further contains an antioxidant. Furthermore, it is preferable that the antioxidant is a phosphite ester compound.


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