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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10703850 B1

PDFFull Text
Date of Patent:
Jul. 07, 2020

Filed:

Dec. 19, 2016

Resin composition

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Natsuko Chayama, Otsu, JP;

Tomoyuki Yuba, Otsu, JP;

Yuma Sugisaki, Otsu, JP;

Assignee:

TORAY INDUSTRIES, INC., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch LLP

Primary Examiner:

Anca Eoff

Int. Cl.
CPC ...
C08G 12/08 (2006.01); C08G 18/08 (2006.01); C08G 18/32 (2006.01); C08G 18/38 (2006.01); C08G 18/76 (2006.01); C08G 69/32 (2006.01); C08G 73/10 (2006.01); H01M 4/131 (2010.01); H01M 4/1391 (2010.01); H01M 4/62 (2006.01); H01M 10/0525 (2010.01); C08K 3/00 (2018.01); H01G 11/38 (2013.01); C08K 3/22 (2006.01); C08K 3/26 (2006.01); C08K 5/17 (2006.01); C08K 5/3432 (2006.01); H01G 9/00 (2006.01); H01G 9/042 (2006.01); H01M 4/04 (2006.01); H01M 4/485 (2010.01); H01M 10/0585 (2010.01); C08G 8/04 (2006.01);
U.S. Cl.
CPC ...
C08G 12/08 (2013.01); C08G 18/0823 (2013.01); C08G 18/3243 (2013.01); C08G 18/3821 (2013.01); C08G 18/3872 (2013.01); C08G 18/7614 (2013.01); C08G 18/7621 (2013.01); C08G 18/7671 (2013.01); C08G 18/7678 (2013.01); C08G 69/32 (2013.01); C08G 73/105 (2013.01); C08G 73/1067 (2013.01); C08G 73/1071 (2013.01); C08K 3/00 (2013.01); C08K 3/22 (2013.01); C08K 3/26 (2013.01); C08K 5/17 (2013.01); C08K 5/3432 (2013.01); H01G 9/0029 (2013.01); H01G 9/042 (2013.01); H01G 11/38 (2013.01); H01M 4/0402 (2013.01); H01M 4/131 (2013.01); H01M 4/1391 (2013.01); H01M 4/485 (2013.01); H01M 4/622 (2013.01); H01M 4/623 (2013.01); H01M 4/625 (2013.01); C08G 8/04 (2013.01); C08K 2003/262 (2013.01); H01M 10/0525 (2013.01); H01M 10/0585 (2013.01); Y02E 60/122 (2013.01); Y02T 10/7011 (2013.01);
Abstract

A resin composition contains: (a) a resin which constitutes a polymer having a structure represented by any one of the following general formulae (1) to (3) below and/or a copolymer having the structure; and (b) a basic compound, wherein Ris a C-Corganic group, Ris a divalent C-Corganic group, X is a sulfonic group, hydroxy group, or carboxy group, p is 1 to 4, and n is 2 to 100,000; wherein Ris a C-Corganic group, Ris a divalent C-Corganic group, Y is a sulfonic group, hydroxy group, or carboxy group, q is 1 to 4, and m is 2 to 100,000; wherein Rrepresents a C-Corganic group, Ris a divalent C-Corganic group, Z is a sulfonic group, hydroxy group, or carboxy group, r is 1 to 4, and l is 2 to 100,000.

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