The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Sep. 19, 2018
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Masafumi Morisue, Tokyo, JP;

Yoshiyuki Nakagawa, Kawasaki, JP;

Kazuhiro Yamada, Yokohama, JP;

Takuro Yamazaki, Inagi, JP;

Ryo Kasai, Tokyo, JP;

Tomoko Kudo, Kawasaki, JP;

Takashi Sugawara, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14 (2013.01); B41J 2/14016 (2013.01); B41J 2/162 (2013.01); B41J 2/1603 (2013.01); B41J 2/1623 (2013.01); B41J 2/1628 (2013.01); B41J 2/1629 (2013.01); B41J 2/1631 (2013.01); B41J 2/1639 (2013.01); B41J 2/1642 (2013.01); B41J 2/1646 (2013.01); B41J 2002/14467 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/12 (2013.01);
Abstract

Provided is a liquid ejection head including: a substrate; an energy-generating element, which is arranged on the substrate, and is used for ejecting a liquid; a flow path forming member, which has an ejection orifice for ejecting the liquid, and is configured to form a flow path of the liquid between the flow path forming member and the substrate; an electrode configured to generate a flow of the liquid; and a wiring, which is arranged so as to be brought into contact with the flow path forming member, and is configured to supply electric power to the electrode, in which the flow path forming member contains an organic material, and in which the electrode and the wiring are each formed of a conductive adhesive layer containing at least one of conductive diamond-like carbon or tin-doped indium oxide.


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