The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Sep. 19, 2018
Applicant:

Toppan Printing Co., Ltd., Tokyo, JP;

Inventors:

Megumi Kashiwame, Tokyo, JP;

Masashi Hattori, Tokyo, JP;

Tatsuhiko Furuta, Tokyo, JP;

Masamitsu Nagahama, Tokyo, JP;

Akira Sato, Tokyo, JP;

Masatoshi Takahashi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 23/12 (2006.01); B32B 27/32 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/18 (2006.01);
U.S. Cl.
CPC ...
B32B 27/32 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/18 (2013.01); C08L 23/12 (2013.01); B32B 2307/412 (2013.01); B32B 2307/54 (2013.01); B32B 2307/584 (2013.01); B32B 2307/704 (2013.01); B32B 2451/00 (2013.01); C08L 2205/025 (2013.01); Y02P 20/544 (2015.11);
Abstract

A decorative sheet that has a transparent resin layer having good V groove bending processability (post-processability) while maintaining high scratch resistance and transparency and a method of producing the decorative sheet. A decorative sheet () according to the present embodiment is a decorative sheet including at least a transparent resin layer () containing a highly crystalline polypropylene resin as a main component. The transparent resin layer () contains a low crystalline polypropylene resin added thereto in the range of 0.1 part by mass or more and 20 parts by mass or less relative to 100 parts by mass of the highly crystalline polypropylene resin, the low crystalline polypropylene resin having a tensile modulus in the range of 25 MPa or more and 500 MPa or less.


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