The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2020
Filed:
Dec. 21, 2018
Applicant:
Massachusetts Institute of Technology, Cambridge, MA (US);
Inventors:
Nikhil Padhye, Sunnyvale, CA (US);
David Moore Parks, Pembroke, MA (US);
Bernhardt Levy Trout, Lexington, MA (US);
Alexander H. Slocum, Bow, NH (US);
Assignee:
Massachusetts Institute of Technology, Cambridge, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/02 (2006.01); B32B 37/06 (2006.01); B32B 37/10 (2006.01); C09J 5/00 (2006.01); B29C 65/14 (2006.01); B29C 65/72 (2006.01); B29C 65/82 (2006.01); B29C 65/00 (2006.01); G05G 15/08 (2006.01); B32B 37/00 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29C 65/02 (2013.01); B29C 65/006 (2013.01); B29C 65/1432 (2013.01); B29C 65/72 (2013.01); B29C 65/8215 (2013.01); B29C 65/8223 (2013.01); B29C 66/1122 (2013.01); B29C 66/341 (2013.01); B29C 66/43 (2013.01); B29C 66/45 (2013.01); B29C 66/73117 (2013.01); B29C 66/73921 (2013.01); B29C 66/83221 (2013.01); B29C 66/83411 (2013.01); B29C 66/83413 (2013.01); B29C 66/91945 (2013.01); B29C 66/92 (2013.01); B29C 66/9221 (2013.01); B29C 66/9261 (2013.01); B32B 37/06 (2013.01); B32B 37/10 (2013.01); C09J 5/00 (2013.01); G05G 15/08 (2013.01); B29C 66/71 (2013.01); B29C 66/723 (2013.01); B29C 66/73121 (2013.01); B29C 66/73151 (2013.01); B29C 66/73772 (2013.01); B29C 66/73774 (2013.01); B29C 66/81 (2013.01); B29C 66/8161 (2013.01); B29K 2105/0038 (2013.01); B32B 2037/0092 (2013.01); B32B 2309/02 (2013.01); C09J 2400/226 (2013.01);
Abstract
Methods and apparatuses for bonding polymeric parts are disclosed. Specifically, in one embodiment, the polymeric parts are bonded by plastically deforming them against each other while they are below the glass transition temperatures.