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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10702923 B1

PDFFull Text
Date of Patent:
Jul. 07, 2020

Filed:

Oct. 05, 2016

Method of manufacturing ni alloy part

Applicant:

Ihi Corporation, Koto-ku, JP;

Inventors:

Nobuyasu Tsuno, Tokyo, JP;

Shuji Ikeda, Tokyo, JP;

Assignee:

IHI Corporation, Koto-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Kevin E Yoon

Assistant Examiner:

Ryan L Heckman

Int. Cl.
CPC ...
B22F 5/00 (2006.01); B22F 3/24 (2006.01); C22F 1/10 (2006.01); F01D 25/00 (2006.01); B22F 3/02 (2006.01); F04D 29/38 (2006.01); F02C 7/00 (2006.01); B22F 5/04 (2006.01); C22C 19/05 (2006.01); B22F 3/16 (2006.01); F04D 29/32 (2006.01); C22F 1/00 (2006.01);
U.S. Cl.
CPC ...
B22F 5/009 (2013.01); B22F 3/02 (2013.01); B22F 3/16 (2013.01); B22F 3/24 (2013.01); B22F 5/04 (2013.01); C22C 19/05 (2013.01); C22C 19/055 (2013.01); C22C 19/056 (2013.01); C22F 1/10 (2013.01); F01D 25/00 (2013.01); F02C 7/00 (2013.01); F04D 29/324 (2013.01); F04D 29/38 (2013.01); B22F 2003/248 (2013.01); B22F 2302/45 (2013.01); B22F 2998/10 (2013.01); C22F 1/00 (2013.01);
Abstract

A method of manufacturing a Ni alloy part includes a solution treatment step of solution treating a sintered compact, which is obtained by sintering and molding a precipitation hardening Ni alloy powder by metal injection molding, by allowing the sintered compact to hold at a temperature of not lower than 1050° C. but not higher than 1250° C. for one hour to five hours, followed by rapidly cooling to room temperature, where the precipitation hardening Ni alloy powder, and an aging treatment step of aging-treating the solution-treated sintered compact by allowing the solution-treated sintered compact to hold at the temperature of not lower than 600° C. but not higher than 800° C., followed by cooling to room temperature.

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