The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2020
Filed:
Jul. 30, 2018
Applicant:
Mankiewicz Gebr. & Co. Gmbh & Co. KG, Hamburg, DE;
Inventors:
Assignee:
MANKIEWICZ GEBR. & CO. GMBH & CO. KG, Hamburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 1/02 (2006.01); B63B 59/00 (2006.01); C09D 5/34 (2006.01); C09D 7/40 (2018.01); C08K 7/22 (2006.01); C09D 163/00 (2006.01); C23C 14/34 (2006.01); C08G 59/44 (2006.01); C08G 59/50 (2006.01); B05B 12/14 (2006.01); B05B 7/32 (2006.01);
U.S. Cl.
CPC ...
B05D 1/02 (2013.01); B63B 59/00 (2013.01); C08K 7/22 (2013.01); C09D 5/34 (2013.01); C09D 7/70 (2018.01); C09D 163/00 (2013.01); C23C 14/34 (2013.01); B05B 7/32 (2013.01); B05B 12/1418 (2013.01); C08G 59/44 (2013.01); C08G 59/50 (2013.01);
Abstract
A composition for producing a putty. The composition includes a binder component with 40 to 95 wt.-% of an epoxy resin based on a total mass of the binder component, a hardener component with 5 to 70 wt.-% of an NH-group-containing compound relative to a total mass of the hardener component, and 0.1 to 15 wt.-% of synthetic hollow bodies based on a total mass of the putty. The synthetic hollow bodies have a density of 0.005 to 0.8 g/cm.