The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2020
Filed:
Sep. 27, 2019
Furukawa Electric Co., Ltd., Tokyo, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Takeo Uno, Tokyo, JP;
Yuko Okuno, Tokyo, JP;
Takahiro Tsuruta, Tokyo, JP;
Yoshimasa Nishi, Kyoko, JP;
Sunao Fukutake, Kyoto, JP;
Furukawa Electric Co., Ltd., Tokyo, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A surface-treated copper foil of the present disclosure includes a copper foil substrate, at least one surface of which has a surface treatment coat including at least a roughening-treated surface on which roughening particles are formed. Observation of a cross-section of the surface-treated copper foil with a scanning electron microscope shows that on a surface of the surface treatment coat, a standard deviation of the particle height of the roughening particles is 0.16 μm or more and 0.30 μm or less, and an average value of the ratio of the particle height to the particle width (particle height/particle width) of the roughening particles is 2.30 or more and 4.00 or less.