The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2020

Filed:

Mar. 31, 2015
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Stewart R. Wyatt, Boise, ID (US);

Don E. Saunders, Boise, ID (US);

Scott David Hahn, Boise, ID (US);

Cameron L. Hutchings, Boise, ID (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); G06F 3/042 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0274 (2013.01); G06F 3/0421 (2013.01); H05K 1/0271 (2013.01); H05K 1/0306 (2013.01); H05K 1/09 (2013.01); H05K 3/46 (2013.01); G06F 2203/04103 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09136 (2013.01); H05K 2201/09145 (2013.01); H05K 2201/09781 (2013.01);
Abstract

According to an example, a device may comprise a printed circuit board. The printed circuit board may further comprise a first layer and a second layer. The first layer may comprise a first material and the second layer may comprise a second material. In some examples, the first layer may further comprise at least one mounting hole surrounded by a third material at a thickness equal to a thickness of the first layer, and the first material may be electrically isolated from the third material. In some examples, the printed circuit board may be mated to a light guide assembly for a touchscreen system.


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