The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2020

Filed:

Mar. 13, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventor:

Lei Shan, Carmel, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0231 (2013.01); H05K 1/183 (2013.01); H05K 1/184 (2013.01); H05K 3/3494 (2013.01); H05K 3/305 (2013.01); H05K 3/3405 (2013.01); H05K 2201/10015 (2013.01); H05K 2203/0156 (2013.01); H05K 2203/1394 (2013.01);
Abstract

Embodiments are directed to a method of embedding a discrete component in a substrate. The method includes forming a cavity in the substrate. The method further includes inserting a discrete component into the cavity, wherein the discrete component comprises a top terminal and a bottom terminal. The method further includes positioning the discrete component within the cavity such that the top terminal is above the bottom terminal and below a front face of the substrate. The method further includes forming an intermediate conductive material within the cavity and over the top terminal. The method further includes forming a top conductive material over the intermediate conductive material such that the top conductive material is electrically coupled through the intermediate conductive material to the top terminal.


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