The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2020

Filed:

May. 13, 2019
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Young-Sik Choi, Seoul, KR;

Jong-Min Choi, Gyeonggi-do, KR;

Woong-Chan Kim, Gyeonggi-do, KR;

Dae-Hyeong Park, Gyeonggi-do, KR;

Sung-Gun Cho, Gyeonggi-do, KR;

Min-Sung Lee, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/52 (2006.01); H01R 13/66 (2006.01); H01R 24/58 (2011.01); H04M 1/02 (2006.01); H01R 12/71 (2011.01); H01R 43/20 (2006.01); H01R 43/24 (2006.01); H01R 13/443 (2006.01); H04M 1/18 (2006.01);
U.S. Cl.
CPC ...
H01R 13/5202 (2013.01); H01R 12/71 (2013.01); H01R 13/5216 (2013.01); H01R 13/5219 (2013.01); H01R 13/6658 (2013.01); H01R 24/58 (2013.01); H01R 43/205 (2013.01); H01R 43/24 (2013.01); H04M 1/0274 (2013.01); H01R 13/443 (2013.01); H01R 2201/04 (2013.01); H01R 2201/06 (2013.01); H01R 2201/16 (2013.01); H04M 1/18 (2013.01);
Abstract

A connection device and method of manufacturing the same is provided. The connection device includes a housing including a first face, into which a plug is introduced, and a second face, that is formed to be in contact with the first face; a connection hole extending to the inside of the housing from the first face; an opening extending from the first face to the second face to partially expose the connection hole on at least the second face; and a sealing member arranged on an outer peripheral surface of the housing to surround a region where the opening is formed.


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