The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2020
Filed:
May. 01, 2018
Applicant:
Skyworks Solutions, Inc., Woburn, MA (US);
Inventor:
Ki Wook Lee, Irvine, CA (US);
Assignee:
Skyworks Solutions, Inc., Woburn, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H05K 3/46 (2006.01); H05K 3/42 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H01Q 9/04 (2006.01); H01Q 1/24 (2006.01); H01Q 1/22 (2006.01); H01Q 1/36 (2006.01); H05K 3/06 (2006.01); H05K 3/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/38 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/2291 (2013.01); H01Q 1/242 (2013.01); H01Q 1/36 (2013.01); H01Q 9/0407 (2013.01); H05K 1/0224 (2013.01); H05K 1/115 (2013.01); H05K 3/42 (2013.01); H05K 3/4697 (2013.01); H05K 3/0026 (2013.01); H05K 3/027 (2013.01); H05K 3/06 (2013.01); H05K 3/4602 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1178 (2013.01);
Abstract
A printed circuit board can include a substrate layer, a first metal layer disposed over the substrate layer, a core layer disposed over the first metal layer, and a second metal layer disposed over the core layer, where the core layer defines a closed cavity between the first and second metal layers. Optionally, the cavity is filled with air and operates as an antenna.