The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2020

Filed:

Jun. 20, 2018
Applicant:

Realtek Semiconductor Corporation, Hsinchu, TW;

Inventors:

Kai-Yi Huang, Taipei, TW;

Sheng-Hung Lin, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01F 17/00 (2006.01); H01F 27/36 (2006.01); H01L 23/528 (2006.01); H01F 21/12 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01F 17/0006 (2013.01); H01F 27/362 (2013.01); H01L 23/528 (2013.01); H01L 23/5223 (2013.01); H01L 23/5225 (2013.01); H01F 2017/008 (2013.01); H01F 2021/125 (2013.01);
Abstract

An integrated circuit structure includes a substrate, an integrated inductor, multiple components, multiple metal interconnections, a first shielding structure, and a second shielding structure. The integrated inductor is substantially formed in a first layer of the integrated circuit structure. The metal interconnections are coupled to the integrated inductor and the components. The first shielding structure is formed between the first layer and the substrate and is substantially beneath the integrated inductor. The second shielding structure is formed between the first layer and the substrate, has substantially the same distribution as the metal interconnections, and is substantially beneath the metal interconnections. The first shielding structure and the second shielding structure are equipotential.


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