The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2020
Filed:
Jul. 17, 2018
Samsung Electronics Co., Ltd., Suwon-si, KR;
Bong Soo Kim, Suwon-Si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A fan-out semiconductor package includes: a core member having a through-hole; a semiconductor chip disposed in the through-hole of the core member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant covering at least portions of the core member and the semiconductor chip and filling at least portions of the through-hole; and a connection member disposed on the core member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads. The core member has a recess portion penetrating through at least portions of the core member, and at least a portion of the recess portion is filled with the encapsulant.