The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2020

Filed:

May. 09, 2018
Applicant:

Silicon Laboratories Inc., Austin, TX (US);

Inventors:

Michael R. May, Austin, TX (US);

Charles Guo Lin, Austin, TX (US);

Carlos Briseno-Vidrios, Austin, TX (US);

Assignee:

Silicon Laboratories Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/642 (2013.01); H01L 24/47 (2013.01);
Abstract

An integrated circuit isolation product includes a first integrated circuit die. The first integrated circuit die includes a first terminal and a second terminal adjacent to the first terminal. The first terminal and the second terminal are configured as a differential pair of terminals configured to communicate a differential signal across an isolation barrier. The first integrated circuit die includes at least one additional terminal adjacent to the differential pair of terminals. The at least one additional terminal is disposed symmetrically with respect to the differential pair of terminals. The first terminal may have a first parasitic capacitance and the second terminal may have a second parasitic capacitance. The first parasitic capacitance may be substantially the same as the second parasitic capacitance. The at least one additional terminal may be disposed symmetrically with respect to a line of symmetry for the differential pair of terminals.


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