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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10699991 B1

PDFFull Text
Date of Patent:
Jun. 30, 2020

Filed:

Dec. 14, 2017

Packaged light emitting devices including electrode isolation structures and methods of forming packaged light emitting devices including the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Chi-Goo Kang, Yongin-si, KR;

Sun-Woo Kim, Hwaseong-si, KR;

Jong-Sup Song, Hwaseong-si, KR;

Ho-Young Song, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Eduardo A Rodela

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 33/44 (2010.01); H01L 23/00 (2006.01); H01L 33/38 (2010.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49548 (2013.01); H01L 23/48 (2013.01); H01L 23/495 (2013.01); H01L 23/4951 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 24/14 (2013.01); H01L 33/387 (2013.01); H01L 33/44 (2013.01); H01L 33/48 (2013.01); H01L 33/483 (2013.01); H01L 33/62 (2013.01); H01L 33/486 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2924/181 (2013.01);
Abstract

A packaged light emitting device can include a mounting substrate including first and second electrode portions that are separated by a recess defined by a first side surface of the first electrode portion and a second side surface of the second electrode portion that is opposite the first side surface. An insulation support member can partially fill a lower portion of the recess to partially cover the first side surface and partially cover the second side surface. A light emitting device can be coupled to the first and second electrode portions of the mounting substrate and a sealing member can be on the mounting substrate covering the light emitting device.

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