The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2020
Filed:
Aug. 08, 2018
Applicant:
Stmicroelectronics Sdn Bhd, Muar, MY;
Inventor:
Cheeyang Ng, Muar, MY;
Assignee:
STMicroelectronics SDN BHD, Muar, MY;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49541 (2013.01); H01L 23/3142 (2013.01); H01L 23/4952 (2013.01); H01L 23/49575 (2013.01); H01L 23/49582 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 23/3107 (2013.01); H01L 23/49513 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48245 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1711 (2013.01); H01L 2924/17738 (2013.01); H01L 2924/17747 (2013.01); H01L 2924/20641 (2013.01); H01L 2924/20642 (2013.01); H01L 2924/20643 (2013.01); H01L 2924/20644 (2013.01); H01L 2924/20645 (2013.01);
Abstract
An integrated circuit (IC) device includes an IC die and a plurality of leads. Each lead includes an unplated proximal end including a first material, and an unplated distal end including the first material. A plated bond wire portion extends between the proximal and distal ends and includes the first material and a plating of a second material thereon. A plurality of bond wires extend between the IC die and the plated bond wire portions of the leads. An encapsulation material surrounds the IC die and bond wires so that the unplated proximal end and plated bond wire portion of each lead are covered by the encapsulation material.