The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2020

Filed:

Dec. 27, 2018
Applicant:

Abb Schweiz Ag, Baden, CH;

Inventors:

Daniel Kearney, Zürich, CH;

Jürgen Schuderer, Zürich, CH;

Slavo Kicin, Zürich, CH;

Liliana Duarte, Opfikon, CH;

Assignee:

ABB Schweiz AG, Baden, CH;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/473 (2006.01); H01L 25/07 (2006.01); H05K 1/02 (2006.01); H01L 23/538 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 25/071 (2013.01); H05K 1/0203 (2013.01); H05K 1/0272 (2013.01); H01L 23/5386 (2013.01); H05K 1/185 (2013.01); H05K 2201/064 (2013.01); H05K 2201/10166 (2013.01);
Abstract

An electronics package includes an electrically conducting support layer; at least one electrically conducting outer layer; at least two power electronics components arranged on different sides of the support layer and electrically interconnected with the support layer and with the at least one outer layer; and isolation material, in which the support layer and the at least two power electronics components are embedded, the support layer and the at least one outer layer are laminated together with the isolation material; and a cooling channel for conducting a cooling fluid through the electronics package, the cooling channel runs between the at least two power electronics components through the support layer.


Find Patent Forward Citations

Loading…