The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2020
Filed:
Feb. 24, 2017
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Jae Ho Chung, Suwon-si, KR;
Soo Ho Noh, Suwon-si, KR;
Jin Seok Park, Hwaseong-si, KR;
Se Young Jang, Seongnam-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/427 (2006.01); H01L 23/367 (2006.01); C09K 5/14 (2006.01); G06F 1/20 (2006.01); H05K 9/00 (2006.01); H05K 7/20 (2006.01); H05K 1/02 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); C09K 5/14 (2013.01); G06F 1/20 (2013.01); G06F 1/203 (2013.01); H01L 23/3736 (2013.01); H05K 1/0203 (2013.01); H05K 7/20 (2013.01); H05K 7/20209 (2013.01); H05K 9/00 (2013.01); H05K 1/0216 (2013.01); H05K 2201/10371 (2013.01);
Abstract
An electronic device according to various embodiments of the present disclosure includes a housing, a printed circuit board located inside the housing, an electrical element mounted on the printed circuit board, and a shield can that covers the electrical element. A recess area is formed on at least a portion of the shield can, and a metal structure is mounted in the recess area to cool heat generated by the electrical element.