The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10699916 B1

Date of Patent:

Jun. 30, 2020

Filed:

Apr. 05, 2017

Mold release film, process for its production, and process for producing semiconductor package

Applicant:

Agc Inc., Chiyoda-ku, JP;

Inventors:

Wataru Kasai, Chiyoda-ku, JP;

Masami Suzuki, Chiyoda-ku, JP;

Assignee:

AGC Inc., Chiyoda-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Sheeba Ahmed

Int. Cl.

CPC ...

B29C 70/70 (2006.01); B29C 33/68 (2006.01); B32B 27/00 (2006.01); B32B 27/30 (2006.01); B32B 27/18 (2006.01); B32B 7/12 (2006.01); B32B 27/20 (2006.01); B32B 27/06 (2006.01); B32B 25/08 (2006.01); B32B 3/30 (2006.01); B32B 25/20 (2006.01); B32B 27/32 (2006.01); B32B 27/16 (2006.01); B32B 27/34 (2006.01); B32B 27/08 (2006.01); H01L 21/56 (2006.01); B32B 27/28 (2006.01); B32B 25/04 (2006.01); B32B 27/36 (2006.01); B29L 31/34 (2006.01); H01L 23/00 (2006.01);

U.S. Cl.

CPC ...

H01L 21/565 (2013.01); B29C 33/68 (2013.01); B29C 70/70 (2013.01); B32B 3/30 (2013.01); B32B 7/12 (2013.01); B32B 25/042 (2013.01); B32B 25/08 (2013.01); B32B 25/20 (2013.01); B32B 27/00 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/16 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/285 (2013.01); B32B 27/30 (2013.01); B32B 27/302 (2013.01); B32B 27/304 (2013.01); B32B 27/32 (2013.01); B32B 27/322 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); H01L 21/566 (2013.01); B29K 2995/0005 (2013.01); B29L 2031/3406 (2013.01); B32B 2250/02 (2013.01); B32B 2250/24 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2270/00 (2013.01); B32B 2307/21 (2013.01); B32B 2307/306 (2013.01); B32B 2307/50 (2013.01); B32B 2307/538 (2013.01); B32B 2307/54 (2013.01); B32B 2307/7242 (2013.01); B32B 2307/732 (2013.01); B32B 2307/748 (2013.01); B32B 2457/00 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48155 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/181 (2013.01);

Abstract

To provide a mold release film which has excellent mold releasing property and is capable of reducing contamination of a mold in a sealing step; a process for producing the mold release film; and a process for producing a semiconductor package by using the mold release film. The mold release filmis a mold release film to be disposed on a surface of a mold which is to be in contact with a curable resin, in the production of a semiconductor package by disposing a semiconductor element in the mold, and sealing it with the curable resin to form a resin sealed portion. This mold release filmcomprises a resin-side mold release layerto be in contact with the curable resin at the time of forming the resin sealed portion, and a gas barrier layer. The gas barrier layercontains at least one polymer (I) selected from the group consisting of a polymer having vinyl alcohol units and a polymer having vinylidene chloride units, and the thickness of the gas barrier layeris from 0.1 to 5 μm.

Find Patent Forward Citations

Kasai, Wataru. (2020). Mold release film, process for its production, and process for producing semiconductor package (U.S. Patent No. 10699916). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10699916

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile