The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2020

Filed:

Aug. 31, 2017
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Ryan Travis Evans, Bellevue, WA (US);

Bernard Maurice Schultz, III, Bothell, WA (US);

Jason Edward Tripard, Mercer Island, WA (US);

Ketan R. Shah, Redmond, WA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); B32B 7/12 (2006.01); H01L 23/10 (2006.01); G06F 1/18 (2006.01); H01L 23/04 (2006.01);
U.S. Cl.
CPC ...
G06F 1/1626 (2013.01); B32B 7/12 (2013.01); G06F 1/1601 (2013.01); G06F 1/1616 (2013.01); G06F 1/1656 (2013.01); G06F 1/181 (2013.01); H01L 23/10 (2013.01); G06F 2200/1633 (2013.01); H01L 23/04 (2013.01); H01L 2224/1601 (2013.01); H01L 2924/164 (2013.01); H01L 2924/16152 (2013.01);
Abstract

A computing device is described. The computing device includes a support structure with an interface surface that has a cross-sectional width. The computing device includes a cover adhered to the interface surface of the support structure along an entirety of the cross-sectional width of the interface surface. A method of manufacturing a computing device is described. The method includes applying an adhesive to a cover. A support structure of a computing device is heated. The support structure is cooled. While the support structure is heated and cooled, pressure is applied to the cover.


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