The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2020

Filed:

Aug. 29, 2018
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Sung-Eun Park, Gyeonggi-do, KR;

Jong-Chun Wee, Gyeonggi-do, KR;

Wook-Jin Lee, Suwon-si, KR;

Jae-Uk Ahn, Incheon, KR;

Assignee:

Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/06 (2006.01); G04B 37/08 (2006.01); G04G 17/02 (2006.01); H04R 1/44 (2006.01); G04G 17/08 (2006.01); G04G 17/04 (2006.01); G04G 13/00 (2006.01); H04R 1/02 (2006.01); H04R 1/10 (2006.01);
U.S. Cl.
CPC ...
G04B 37/08 (2013.01); G04G 13/00 (2013.01); G04G 17/02 (2013.01); G04G 17/04 (2013.01); G04G 17/08 (2013.01); H04R 1/023 (2013.01); H04R 1/44 (2013.01); H05K 5/061 (2013.01); H04R 1/025 (2013.01); H04R 1/1041 (2013.01); H04R 2420/07 (2013.01); H04R 2420/09 (2013.01);
Abstract

An electronic device is disclosed including a housing including an outer wall, an inner, and a first through hole formed in the inner space, an audio module located in the inner space, a support structure located in the inner space between the audio module and the first through hole and including a second through hole; and a waterproof structure located in the inner space between the support structure and the outer wall including a flexible gasket. The gasket may include an outer rim, a recess portion moveable between the first through hole and the second through hole, and a connection portion between the rim and the recess portion, including at least one opening around the recess portion, such that the opening and the second through-hole form a sound path between the audio module and the first through-hole in the absence of pressure from an external liquid.


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