The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2020
Filed:
Jan. 30, 2019
Applicant:
Koito Manufacturing Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
KOITO MANUFACTURING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/02 (2019.01); F21V 3/06 (2018.01); B29C 45/00 (2006.01); F21V 3/02 (2006.01); B29L 31/30 (2006.01); B29L 11/00 (2006.01);
U.S. Cl.
CPC ...
F21V 3/062 (2018.02); B29C 45/0001 (2013.01); B29C 45/0025 (2013.01); F21V 3/02 (2013.01); B29C 45/0046 (2013.01); B29C 2045/0027 (2013.01); B29K 2995/0026 (2013.01); B29K 2995/0094 (2013.01); B29K 2995/0097 (2013.01); B29L 2011/00 (2013.01); B29L 2031/30 (2013.01);
Abstract
A resin molded product produced by injection molding includes: a gate mark formed on a non-design surface; and a step provided so as to intersect with a flow of a resin injected from a gate. When a flow distance of the resin from the gate mark to an end portion of the resin molded product is L [mm], and a thickness of the resin molded product is t [mm], the resin molded product is configured to have L/t of 185 or more, and a tangential angle of the step is 5° to 30°.