The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2020

Filed:

Jan. 08, 2016
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Xi Yang, Dayton, OH (US);

Brian Peterson, Dayton, OH (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B28B 1/00 (2006.01); B28B 1/14 (2006.01); B28B 11/24 (2006.01); B28B 7/34 (2006.01); B29L 31/00 (2006.01); C04B 35/111 (2006.01); C04B 35/622 (2006.01); C04B 37/02 (2006.01); C04B 35/14 (2006.01); C04B 35/48 (2006.01); C04B 35/505 (2006.01); F01D 5/18 (2006.01); B28B 23/02 (2006.01); C04B 37/00 (2006.01); B32B 18/00 (2006.01); B29K 101/10 (2006.01); B29K 101/12 (2006.01);
U.S. Cl.
CPC ...
F01D 5/18 (2013.01); B28B 1/008 (2013.01); B28B 1/14 (2013.01); B28B 7/342 (2013.01); B28B 11/24 (2013.01); B28B 23/02 (2013.01); B32B 18/00 (2013.01); C04B 35/111 (2013.01); C04B 35/14 (2013.01); C04B 35/48 (2013.01); C04B 35/505 (2013.01); C04B 35/622 (2013.01); C04B 37/001 (2013.01); C04B 37/021 (2013.01); B29K 2101/10 (2013.01); B29K 2101/12 (2013.01); B29L 2031/757 (2013.01); C04B 2235/483 (2013.01); C04B 2235/6022 (2013.01); C04B 2235/6028 (2013.01); C04B 2235/94 (2013.01); C04B 2235/945 (2013.01); C04B 2237/341 (2013.01); C04B 2237/343 (2013.01); C04B 2237/345 (2013.01); C04B 2237/84 (2013.01); F05D 2220/30 (2013.01); F05D 2230/211 (2013.01); F05D 2300/20 (2013.01); F05D 2300/603 (2013.01);
Abstract

This invention relates to a product and a method of preparing ceramic and/or ceramic hybrid materials through the construction of a printed die. The printed die being made by three dimensional printing or additive manufacturing processes possesses both an external geometry and an internal geometry.


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