The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2020
Filed:
Jun. 07, 2018
The Regents of the University of Michigan, Ann Arbor, MI (US);
Jinsang Kim, Ann Arbor, MI (US);
Chen Li, Ann Arbor, MI (US);
Apoorv Shanker, Ann Arbor, MI (US);
Kevin Pipe, Ann Arbor, MI (US);
Gun-Ho Kim, Ulsan, KR;
THE REGENTS OF THE UNIVERSITY OF MICHIGAN, Ann Arbor, MI (US);
Abstract
Methods of increasing thermal conductivity of a bulk polymer are provided. The methods include contacting a bulk polyelectrolyte polymer comprising an ionizable repeating pendant group with an aqueous liquid having a pH that ionizes the pendant group and isotropically extend the polyelectrolyte polymer to an extended non-globular chain conformation. The polyelectrolyte polymer so treated thus exhibits a thermal conductivity of greater than or equal to about 0.6 W/m·K and optionally greater than or equal to about 1 W/m·K. In other aspects, the present disclosure provides a high thermal conductivity material comprising a bulk polyelectrolyte polymer bearing a repeating charged group and having an extended non-globular chain conformation and that exhibits a thermal conductivity of greater than or equal to about 0.6 W/m·K and optionally greater than or equal to about 1 W/m·K. The high thermal conductivity material may be used in electronic devices, including as housings/encapsulation and thermal interfaces.