The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2020
Filed:
Sep. 14, 2017
Applicant:
E I Du Pont DE Nemours and Company, Wilmington, DE (US);
Inventor:
Yumi Matsuura, Kanagawa, JP;
Assignee:
E. I. DU PONT DE NEMOURS AND COMPANY, Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/02 (2006.01); C09J 9/02 (2006.01); C08L 1/28 (2006.01); C09J 5/06 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C09J 101/28 (2006.01); H01L 23/00 (2006.01); C08K 3/08 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); B23K 35/025 (2013.01); C08L 1/28 (2013.01); C09J 5/06 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 101/28 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); C08K 2003/0806 (2013.01); C08K 2201/001 (2013.01); C09J 2401/00 (2013.01); C09J 2433/00 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/2747 (2013.01); H01L 2224/27332 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29369 (2013.01); H01L 2224/29373 (2013.01); H01L 2224/32151 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/83048 (2013.01); H01L 2224/83097 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83208 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1206 (2013.01); H01L 2924/1207 (2013.01); H01L 2924/13072 (2013.01); H01L 2924/14 (2013.01);
Abstract
The present invention relates to a conductive paste for bonding comprising 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.05 to 3 parts by weight of a polymer, wherein the polymer comprises a first polymer and a second polymer, wherein the molecular weight (Mw) of the first polymer is 5,000 to 95,000, and the molecular weight (Mw) of the second polymer is 100,000 to 300,000.