The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2020

Filed:

Jan. 24, 2019
Applicants:

John Cleaon Moore, Camarillo, CA (US);

Jared Michael Pettit, CAmarillo, CA (US);

Inventors:

John Cleaon Moore, Camarillo, CA (US);

Jared Michael Pettit, CAmarillo, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 9/00 (2006.01); C09J 11/08 (2006.01); C09J 11/04 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); B32B 7/06 (2019.01); B32B 38/10 (2006.01); B32B 38/00 (2006.01); C09J 5/00 (2006.01); C08K 3/013 (2018.01);
U.S. Cl.
CPC ...
C09J 9/00 (2013.01); B32B 7/06 (2013.01); B32B 38/0032 (2013.01); B32B 38/10 (2013.01); C09J 5/00 (2013.01); C09J 11/04 (2013.01); C09J 11/08 (2013.01); H01L 21/6835 (2013.01); H01L 24/27 (2013.01); H01L 24/98 (2013.01); C08K 3/013 (2018.01); C09J 2205/302 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68381 (2013.01);
Abstract

Methods and compositions are described for a temporary adhesive used to affix a work unit onto a carrier substrate whereby its porosity is tuned by choosing and adjusting the polymeric resin and filler components to provide sufficient adhesion to support a manufacturing process, and upon completion, there is advanced penetration of a liquid into the interfacial bond causing release of the work unit without harm. The temporary adhesive provides a tunable porosity that is dependent upon the mathematical calculation of the weight basis ratio of filler to binder, that is preferably greater than 1.0, more preferably greater than 2.0, and most preferably greater than 3.0. The temporary adhesive may be applied and cured in a variety of ways that meet the needs of the form of the work unit and objectives of the manufacturing process. The invention provides benefits of flexibility and reduced cost when establishing practices to handle difficult work units in the manufacture of semiconductors and flat panel displays.


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